English
Production Process
01
Crimp Terminal
02
Terminal Dispensing and Curing
03
Plasma Cleaning
04
Solder Paste Spraying
05
Terminal Fixing and Adhesive Application
06
SPI Inspection
07
Terminal SMT Placement
08
NTC SMT Placement
09
Dry Ice Cleaning
10
Reflow Soldering
11
Solder Joint AOI Inspection
12
NTC Dispensing and Curing
13
Electrical Testing
14
Visual Inspection
15
Packaging
Testing Equipment
| No. | Equipment Name | Main Inspection Items | Inspection Scope | Inspection Accuracy | Applicable Products |
| 1 | 2D Measuring Instrument | Dimensional Measurement | 450*600mm | 0.001mm | FPC，Mold |
| 2 | Tensile Tester | Base Material Peel Strength | W=1cm, 0~500KGF/CM | 0.01KGF | FPC |
| 3 | Solder Pot | Thermal Shock | 300*200mm <288°C | - | FPC |
| 4 | Salt Spray Test Chamber | Gold Surface Corrosion Resistance | 500*300mm | - | FPC |
